Technical Support

Structure

Crystal Resonator

1. Base
2. Cap/Lid
3. Electrode
4. Blank
5. (Conductive) Adhesive
6. Pad

Crystal Oscillator

1. Base
2. IC
3. Bonding wire
4. Blank
5. Lid
6. (Conductive) Adhesive
7. Electrode

Thermistor Crystal

1. Base
2. Cap/Lid
3. Electrode
4. Blank
5. (Conductive) Adhesive
6. Pad
7. Thermistor
8. Eco solder paste

MEMS MICROPHONE

(1)Metal Cap
(2)Base
(3)Mic Sensor
(4)ASIC
(5)Capacitance/Ferrite bead/Resistance
(6)Die Attach Adhesive(I)
(7)Die Attach Adhesive(II)
(8)Conductive Plastic
(9)Gold Wire
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