(4)Research and development status:
The Company’s product development mainly focuses on quartz components and micro-electromechanical sensing components. Quartz components include quartz crystals, general quartz oscillators, temperature compensated quartz oscillators, piezoelectric controlled quartz oscillators and differential output quartz crystal oscillators. The size of its miniaturized products is reduced from 2.0mm x 1.6mm, 1.6mm x 1.2mm to 1.2mm x 1.0mm; the accuracy can reach a frequency change of ±10~±50ppm under the operating temperature of -40~+150℃, meeting the needs of various fields such as consumer electronics products, network communications, and automotive applications. In terms of temperature-compensated quartz oscillators, its accuracy can reach ±0.5ppm. Micro-electromechanical sensing components focus on the layout of product structure design and packaging technology.
In addition, in the post-epidemic era, changes in social activities have accelerated the promotion of 5G networks, and the application of communication technology is rapidly entering the fields of home appliances, vehicles, and industries. In order to strengthen the depth and breadth of existing core products, the Company introduces semiconductor material thinning processing technology and packaging process, and applies it to ultra-high frequency chip process.
R&D achievements in 2022:
Quartz components have completed the development of miniaturized 1.2mm×1.0mm 76.8MHz above quartz crystals. Its wafer adopts semiconductor material thinning processing technology, and has completed 1.6mm x 1.2mm, 2.0mm x 1.6mm size 5G communication product application series, and the temperature range can reach -40~125℃. Some specifications have started to send samples in the fourth quarter of 2022, quartz crystal oscillators and temperature-compensated quartz oscillators have completed 2.0mm x 1.6mm, 2.5mm x 2.0mm, 3.2mm x 2.5 and 2.0mm x 1.6mm wide temperature automotive application product line. The production and shipment of sensing components accounted for 9% of the total annual revenue in 2022.
A. Miniaturization and high precision
Using its semiconductor material thinning processing technology, the Company has promoted the miniaturization of product size to 1.2mm x 1.0mm, and will develop towards smaller specifications in the future. In 2023, it is expected to invest in the development of sensing quartz crystal 1.2mm x 1.0mm size packaging technology process, and optimize the accuracy and stability of existing quartz crystal series products.
B. High frequency and advanced oscillators
Based on the current production method of quartz wafers, the production technology in the frequency range of 1~50 MHZ is already mature. Of the Company’s existing mass production, the frequency is between in the range of 1~212.5MHZ and its production of high-frequency quartz components is mostly handled by frequency doubling. Thus, it is easy to create a phenomenon of chattering (Jitter), resulting in the loss of signal on the transmission (Loss). To solve this problem, the Company expects to actively develop high-frequency chips with fundamental frequency. It is not easy for the traditional technology to process high-frequency chips due to high defect rates, however. The thinning processing technology of semiconductor materials introduced by the company aims to improve the yield and stability for the purpose. Regarding 5G equipment and automotive applications, the Company expects to continue its development of high-unit price quartz oscillators such asVCXO,TCXO, LV-PECL/LVDS/HCSL, and towards miniaturization in the near future.
2022 operation plan summary
Actively develop the market, deepen service quality, and cultivate customer relationships.
Improve R&D technology, develop new products, and increase competitive advantage
Abide by the quality policy, introduce green products, and win the trust of customers.
Implement corporate governance, fulfill social responsibilities, and establish sustainable development.
(2)Expected sales volume: